DIAMOND / WAFER

New methods for industrial diamond production

In recent years various technological approaches for the deposition of monocrystalline and polycrystalline diamond layers have been developed. The production of single-crystal diamond wafers on iridium was established as the best starting material. It has recently been optimized for deposition on small areas (up to approximately 10 × 10 mm²) in combination with substrates made of Si/ yttrium-stabilized zircon-oxide (YSZ), magnesium peroxide (MgO₂) or strontium titanate (SrTiO₃). There is also a suitable process for producing polycrystalline diamond layers on ultra-large areas using the hot filament CVD method.

However, these methods have not yet been widely used in industrial applications. The focus of current research and development is on the reduction of dislocation densities (defects) and of crystal quality with respect to strain, enlargement of single crystalline diamond wafer as well as reproducibility of process parameters.

Diacara will provide you with comprehensive advice on currently available technologies and help you implement your application.